Home › Rehm Thermal Systems Announces Three Next-generation Soldering Solutions
 

Keywords :   


Rehm Thermal Systems Announces Three Next-generation Soldering Solutions

2013-01-01 06:00:00| Industrial Newsroom - All News for Today

Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere &ndash; the Vacuum Soldering process.<br /> <br /> Rehm offers three VS Series Vacuum Soldering system models. They&rsquo;re all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging. The use of different gases as well as formic acid and microwave ...This story is related to the following:Soldering Machinery

Tags: systems solutions thermal announces

Category:Industrial Goods and Services

Latest from this category

All news
01.07Mentorship in Motion
Industrial Goods and Services »
04.07Atlantic Tropical Weather Outlook
04.07Eastern North Pacific Tropical Weather Outlook
04.07Hurricane Beryl Graphics
04.07Hurricane Beryl Public Advisory Number 22A
04.07Summary for Hurricane Beryl (AT2/AL022024)
04.07Japan declares victory in 'war' on floppy disks
04.07'Airport parking firms left us out of pocket'
04.07Jeff Bezos to sell another $5bn of Amazon shares
More »