Home › Rehm Thermal Systems Announces Three Next-generation Soldering Solutions
 

Keywords :   


Rehm Thermal Systems Announces Three Next-generation Soldering Solutions

2013-01-01 06:00:00| Industrial Newsroom - All News for Today

Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere &ndash; the Vacuum Soldering process.<br /> <br /> Rehm offers three VS Series Vacuum Soldering system models. They&rsquo;re all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging. The use of different gases as well as formic acid and microwave ...This story is related to the following:Soldering Machinery

Tags: systems solutions thermal announces

Category:Industrial Goods and Services

Latest from this category

All news
19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
20.11Eastern North Pacific Tropical Weather Outlook
20.11Atlantic Tropical Weather Outlook
19.11Climate change impacts on cattle industry part of UNL study
19.11Sitz Angus praised for 100-plus years of Angus
19.11Enhancing reproductive success in the cow-calf herd
19.11-XX BLACKW 1
19.11 Fender Telecaster Thinline / Surf Green
19.11HG 24.5cm
More »