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SPE Issues Call for Papers for Co-Located Conferences in China on Injection Molding and ...

2013-07-26 06:00:00| Industrial Newsroom - All News for Today

SPE has issued calls for papers for 2 one-day topical conferences (TOPCONs), which will be held in Shanghai, China. While "Shaping the Future of Injection Molding through Game-Changing Innovation" will take place on December 11, "Global Advances in Plastics for Medical Devices and Packaging" will take place on December 12. Deadlines are as follows: author name, paper title, and 250-word abstract by September 15, 2013; full paper by October 15; and PowerPoint® presentation by December 1. This story is related to the following:Trade Associations

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