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Spansion Exhibiting a Range of Automotive Systems at Automotive Engineering Exposition

2014-05-08 06:00:00| Industrial Newsroom - All News for Today

SUNNYVALE, Calif. &mdash; Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, will showcase its microcontroller, analog and flash memory solutions for automotive systems at the Automotive Engineering Exposition, May 21-23 at the Exhibition Hall, Pacifico Yokohama in Yokohama, Japan.<br /> <br /> The demonstrations at the Spansion booth, number 145, will include:<br /> <br /> &bull; Hybrid and electric vehicle microcontroller (MCU) solutions and development tools<br ...This story is related to the following:Flash Memories |

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