Home multilayer
 

Keywords :   


Tag: multilayer

Multi-Layer Linerless Labels increase product info communication.

2015-08-03 14:31:07| Industrial Newsroom - All News for Today

Supporting Food Information Regulations (FIR) via surface area printing capabilities, COMPAC™ Linerless extends applications to include product information across twin layers with up to 3 printable faces. Interactive surface area can be utilized to communicate messages to maximize on-pack communication and on-shelf presence while also promoting brand integrity. Multi-function options including peel and reseal, smart coding, and such multi-open options as tear-away perforation.

Tags: info product increase communication

 

Coveris launch world\'s first multi-layer linerless labels

2015-07-28 07:00:00| Label and Narrow Web Breaking News

The multi-layer format adds further product information across twin layers with up to three printable faces.

Tags: launch labels worlds multilayer

 
 

ESD Protection Devices use multi-layer ceramic technology.

2015-06-19 14:31:06| Industrial Newsroom - All News for Today

Supplied in 1005 and 0603 packages, respectively, Models LXES15AAA1-153 and LXES03AAA1-154 combine low voltage ESD protection with dielectric strength to withstand continued high voltage discharge. Units offer ESD protection according to internationally recognized IEC61000-4-2 Level 1 standard at low voltage and low peak voltage levels. Operating from -40 to +85°C, devices are suited for automotive electronics, antenna terminals, and external interfaces of touch panels, monitors, and switches.

Tags: technology protection devices ceramic

 

SMT Multilayer Varistors are available with glass encapsulation.

2015-05-20 14:31:05| Industrial Newsroom - All News for Today

Glass encapsulated for resistance against harsh environments/processes, Glass Encapsulated TransGuard® and TransGuard Automotive Series provide bi-directional overvoltage protection and EMI/RFI attenuation. These zinc oxide (ZnO)-based ceramic semiconductor devices exhibit sub 1 nsec response times to ESD strikes, offer multi-strike capabilities, and come in 1206, 1210, 1812, and 2220 chip sizes with energy ratings from 0.4–12 J and peak current ratings from 150–2,000 A.

Tags: glass smt encapsulation multilayer

 

PET Preform Barrier Module features multi-layer capabilities.

2015-04-29 14:31:08| Industrial Newsroom - All News for Today

Built on HyPET® HPP5 platform, PET preform barrier module offers manufacturers possibilities to explore PET as packaging material for products requiring enhanced barrier properties. Ability to produce multi-layer preforms with range of barrier content, even below 3%, maximizes flexibility and promotes freedom of design both across and within applications. Precision dosing and range adjustability ensures seasonal variations are considered with relation to shelf life of sensitive products.

Tags: features pet module capabilities

 

Sites : [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] next »