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Tag: multilayer
Multi-Layer Linerless Labels increase product info communication.
2015-08-03 14:31:07| Industrial Newsroom - All News for Today
Supporting Food Information Regulations (FIR) via surface area printing capabilities, COMPAC™ Linerless extends applications to include product information across twin layers with up to 3 printable faces. Interactive surface area can be utilized to communicate messages to maximize on-pack communication and on-shelf presence while also promoting brand integrity. Multi-function options including peel and reseal, smart coding, and such multi-open options as tear-away perforation.
Tags: info
product
increase
communication
Coveris launch world\'s first multi-layer linerless labels
2015-07-28 07:00:00| Label and Narrow Web Breaking News
The multi-layer format adds further product information across twin layers with up to three printable faces.
Tags: launch
labels
worlds
multilayer
ESD Protection Devices use multi-layer ceramic technology.
2015-06-19 14:31:06| Industrial Newsroom - All News for Today
Supplied in 1005 and 0603 packages, respectively, Models LXES15AAA1-153 and LXES03AAA1-154 combine low voltage ESD protection with dielectric strength to withstand continued high voltage discharge. Units offer ESD protection according to internationally recognized IEC61000-4-2 Level 1 standard at low voltage and low peak voltage levels. Operating from -40 to +85°C, devices are suited for automotive electronics, antenna terminals, and external interfaces of touch panels, monitors, and switches.
Tags: technology
protection
devices
ceramic
SMT Multilayer Varistors are available with glass encapsulation.
2015-05-20 14:31:05| Industrial Newsroom - All News for Today
Glass encapsulated for resistance against harsh environments/processes, Glass Encapsulated TransGuard® and TransGuard Automotive Series provide bi-directional overvoltage protection and EMI/RFI attenuation. These zinc oxide (ZnO)-based ceramic semiconductor devices exhibit sub 1 nsec response times to ESD strikes, offer multi-strike capabilities, and come in 1206, 1210, 1812, and 2220 chip sizes with energy ratings from 0.4–12 J and peak current ratings from 150–2,000 A.
Tags: glass
smt
encapsulation
multilayer
PET Preform Barrier Module features multi-layer capabilities.
2015-04-29 14:31:08| Industrial Newsroom - All News for Today
Built on HyPET® HPP5 platform, PET preform barrier module offers manufacturers possibilities to explore PET as packaging material for products requiring enhanced barrier properties. Ability to produce multi-layer preforms with range of barrier content, even below 3%, maximizes flexibility and promotes freedom of design both across and within applications. Precision dosing and range adjustability ensures seasonal variations are considered with relation to shelf life of sensitive products.
Tags: features
pet
module
capabilities
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