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Espial Brings Advanced HTML5 Solutions to TVConnect

2013-03-13 20:30:10| Digital TV News

Espial has announced that it will showcase a comprehensive range of multiscreen television solutions at TV Connect, March 19-21 in London. Visitors to the Espial stand 233 will see its agile IP video delivery system and advanced HTML5 set-top box (STB) client.

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China Power Plant Installs Advanced Integrated Membrane System to Reduce Capital Costs and Decrease Energy Use

2013-03-13 16:02:00| Power Technology

For many years, Double-pass RO + EDI systems have been a widely used water treatment combination to produce ultra-pure water.

Tags: use system advanced power

 
 

Advanced Membrane Degassing Technology for Radiation Source Term Reduction and Corrosion Control in Nuclear Power Plants

2013-03-13 15:46:00| Power Technology

Dissolved gas control in a nuclear power plant's water system, including the primary make-up water storage tank and refueling water storage tank, can be essential to reduce radiation source term (defined as a release of radioactive material).

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AGC And nMode Solutions Launch Subsidiary Triton Micro Technologies To Develop Novel Via-Fill Technology For Advanced Semiconductor Packaging

2013-03-13 02:27:44| rfglobalnet News Articles

Leveraging synergies in their respective technologies, Tokyo-based Asahi Glass Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1M to co-found a subsidiary business,Triton Micro Technologies, to develop innovative via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

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AGC And nMode Solutions Launch Subsidiary Triton Micro Technologies To Develop Novel Via-Fill Technology For Advanced Semiconductor Packaging

2013-03-13 02:27:44| wirelessdesignonline News Articles

Leveraging synergies in their respective technologies, Tokyo-based Asahi Glass Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1M to co-found a subsidiary business,Triton Micro Technologies, to develop innovative via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

Tags: advanced technology solutions develop

 

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