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Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

2015-07-21 12:31:15| Industrial Newsroom - All News for Today

Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and...

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Metrology System supports 3D wafer fabrication.

2015-07-16 14:31:08| Industrial Newsroom - All News for Today

By offering wide range of metrology measurements that drive tighter process control for critical parameters in Logic, Flash, and DRAM, HelioSense100™ Optical CD System supports industry transition to multi-patterning small pitch manufacturing and 3D vertical devices. Standalone system is optimized by NovaMARS modeling software and Nova's high-performance computation solution, allowing customers to utilize system from early R/D stages through to manufacturing and device maturity.

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Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

2015-07-16 12:31:12| Industrial Newsroom - All News for Today

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New JerseyRudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan...

Tags: process partner improve corporation

 

Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

2015-07-14 12:31:14| Industrial Newsroom - All News for Today

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300...

Tags: order system level applications

 

Rudolph Receives JetStep Lithography System Order From Leading OSAT For Copper Pillar Bump And Fan-Out Wafer Level Packaging Applications

2015-07-10 03:23:23| metrologyworld Home Page

Rudolph Technologies, Inc. announced recently that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300 Advanced Packaging Lithography System for the development of next-generation advanced packaging technology

Tags: order system level applications

 

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