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Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
2015-04-30 12:31:11| Industrial Newsroom - All News for Today
The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep Advanced Packaging Lithography...
Tags: level
orders
applications
inspection
Kulicke & Soffa Joins High-Density Fan-Out Wafer Level Packaging Consortium
2015-04-18 13:21:54| Semiconductors - Topix.net
Through the collaboration, K&S is confident that with the combined experience and knowledge, the consortium will extend FOWLP capabilities for applications, such as tablets and smart phones, and provide solutions to overcome current FOWLP limitations. FOWLP enables multiple chips to be integrated in small form factor on a single package.
Tags: level
packaging
joins
consortium
Wafer Bonding Systems support wafers up to 200 mm in diameter.
2015-03-24 13:31:07| Industrial Newsroom - All News for Today
Designed for universities and R&D groups, EVG®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot to support up to 6 process modules for max throughput. Both operate in high-vacuum-process environment.
Tags: support
systems
diameter
bonding
Texas Instruments plans to boost 300mm wafer production to drive growth
2015-02-04 20:09:47| Semiconductors - Topix.net
A Texas Instruments worker looks at a 300-millimeter wafer being made at the company's 5-year-old Richardson factory called "RFAB." Now that Texas Instruments Inc.'s restructuring is complete and annual revenue has started growing again, it plans to boost chip production on larger wafers to drive future growth, two executives said this morning in a webcast with semiconductor analysts.
Tags: drive
production
plans
growth
Dry-Film Negative Photoresist suits MEMS, wafer applications.
2015-01-09 14:30:56| Industrial Newsroom - All News for Today
Optimized for hot roll lamination and processing on micro electro mechanical systems (MEMS) and IC wafers, DF-3020 comes in thickness formats from 5–50 µm, ±5%. Cured chemistry can withstand harsh environments, including extreme moisture and corrosive chemicals; glass transition temperature is 158°C; and moderate modulus is 3.5 GPa at 25°C. Suited for MEMS and wafer-level packaging applications (TSV sealing), hydrophobic product can be used in contact with EMS spin coatable photoresists.
Tags: applications
negative
suits
wafer
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