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450MM Semiconductor Wafer Manufacturing Stalled, And Applied Materials The Biggest Loser
2014-07-22 20:02:32| Semiconductors - Topix.net
The pushout of 450mm wafer chip production will have a large impact on Applied Material's sales over the next 3 years.
Tags: materials
applied
manufacturing
biggest
EV Group Clears Key Barriers To 3D-IC/TSV High-Volume Manufacturing With Breakthrough Fusion Wafer Bonding Solution
2014-07-18 10:37:01| electronicsweb Home Page
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled theGEMINI®FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs)
Tags: group
key
solution
manufacturing
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
2014-07-08 14:31:19| Industrial Newsroom - All News for Today
GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. This story is related to the following:Materials and Material ProcessingSearch for suppliers of: Bonding Machinery
Tags: platform
fusion
promotes
bonding
SMIC and Qualcomm Collaborate on 28nm Wafer Production in China
2014-07-03 14:30:04| Semiconductors - Topix.net
July 3, 2014 -- Semiconductor Manufacturing International Corporation and Qualcomm Incorporated , have announced that SMIC and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, are working together in connection with 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm® Snapdragon™ ... (more)
Tags: china
production
collaborate
wafer
Jordan Valley Semiconductors Wins More Market Share in Advanced Wafer Level Packaging
2014-07-03 06:00:00| Industrial Newsroom - All News for Today
MIGDAL HAEMEK, Israel – Jordan Valley Semiconductors Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (microXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another leading memory player. The tool provides fully automated metrology solutions for several key applications, including single micro-bump chemical ...This story is related to the following:Laboratory and Research Supplies and EquipmentWafer Inspection Systems | X-Ray Inspection Systems
Tags: advanced
level
share
market
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