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Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

2014-07-08 02:45:10| Semiconductors - Topix.net

This release expands on Teradyne's market-leading position by introducing a new RF instrument, the UltraWave24, a new DSP Processor, the UltraDSP1, and the latest version of the Enhanced Signal Analyzer Toolkit.

Tags: test solution generation wireless

 

Teradyne Introduces the Magnum V Memory Test System

2014-07-07 19:53:05| Electronics - Topix.net

Teradyne, Inc. announces the Magnum V, the next generation memory test solution in the Nextest Magnum product line designed for massively parallel memory test in the Flash, DRAM and multi chip package marketplace.

Tags: system test memory introduces

 
 

Teradyne Introduces the Magnum V Memory Test System

2014-07-07 13:21:13| Semiconductors - Topix.net

The Magnum V's scalable platform extends the capabilities of the Magnum product line with higher pin count, higher device under test parallelism, higher frequency, coverage for high-speed Flash and mobile DRAM, and lower per-pin cost for achieving a lower total cost-of-test.

Tags: system test memory introduces

 

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet ...

2014-07-02 06:13:17| Semiconductors - Topix.net

Teradyne, Inc. announces the release of three enhancements to the UltraFLEX platform to meet the emerging needs of the latest generation application and baseband processors for mobile devices.

Tags: options meet enhanced instrument

 

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet ...

2014-07-02 06:11:34| Electronics - Topix.net

Teradyne, Inc. announces the release of three enhancements to the UltraFLEX platform to meet the emerging needs of the latest generation application and baseband processors for mobile devices.

Tags: options meet enhanced instrument

 

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