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Agilent Technologies Offers Expert Video on LTE-A Carrier Aggregation Technology and Test ...

2014-02-07 06:00:00| Industrial Newsroom - All News for Today

What: This new video on LTE-A Carrier Aggregation offers insight into LTE-A device test performed under real world conditions, which represents a challengeintegrated functional and RF test solution for Category 4/6 device test with MIMO, fading and noise generation<br /> <br /> When: Available now<br /> <br /> Where: <a href="http://www.agilent.com/find/CellularVideos">www.agilent.com/find/CellularVideos</a> and <a ...

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Indium Corporation Technology Expert to Present at EPTC

2013-11-25 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.<br /> <br /> Dr. Liu&rsquo;s presentation, An Innovative Composite Solder Preform for TLP Bonding -- Microstructure and Properties of Die-Attach Joints, discusses a special laminate composite preform developed for high temperature Pb-free soldering applications, where a melting temperature of 280°C or higher is required.<br ...

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Indium Corporation Technology Expert to Present at SMTA Penang

2013-11-06 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Sze Pei Lim, Technical Manager - Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.<br /> <br /> Sze Pei&rsquo;s presentation, Optimizing Void Performance of QFN Assembly, explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and the addition of a flux-coated solder preform.<br /> <br /> Sze Pei is responsible for ...

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Indium Corporation Technology Expert to Present at IMPACT Conference in Taiwan

2013-10-10 06:00:00| Industrial Newsroom - All News for Today

<a href="http://www.indium.com/">Indium Corporation</a>&rsquo;s <a href="http://www.indium.com/biographies/ning-cheng-lee/">Dr. Ning-Cheng Lee</a>, Vice President of Technology, will present at the <a href="http://www.impact.org.tw/2013/General/">International Microsystems Packaging Assembly and Circuits Technology conference</a> (IMPACT) on Thursday, October 24 in Taipei, Taiwan. <br /> <br /> Dr. Lee&rsquo;s presentation, A Novel Epoxy Flux on Solder Paste for High-Reliability POP Assembly, ...

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Indium Corporation Technology Expert to Present at IMPACT Conference in Taiwan

2013-10-09 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.<br /> <br /> Dr. Lee&rsquo;s presentation, A Novel Epoxy Flux on Solder Paste for High-Reliability POP Assembly, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when ...

Tags: technology present corporation impact

 

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