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Tag: expert technology
Agilent Technologies Offers Expert Video on LTE-A Carrier Aggregation Technology and Test ...
2014-02-07 06:00:00| Industrial Newsroom - All News for Today
What: This new video on LTE-A Carrier Aggregation offers insight into LTE-A device test performed under real world conditions, which represents a challengeintegrated functional and RF test solution for Category 4/6 device test with MIMO, fading and noise generation<br /> <br /> When: Available now<br /> <br /> Where: <a href="http://www.agilent.com/find/CellularVideos">www.agilent.com/find/CellularVideos</a> and <a ...
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Indium Corporation Technology Expert to Present at EPTC
2013-11-25 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.<br /> <br /> Dr. Liu’s presentation, An Innovative Composite Solder Preform for TLP Bonding -- Microstructure and Properties of Die-Attach Joints, discusses a special laminate composite preform developed for high temperature Pb-free soldering applications, where a melting temperature of 280°C or higher is required.<br ...
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Indium Corporation Technology Expert to Present at SMTA Penang
2013-11-06 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Sze Pei Lim, Technical Manager - Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.<br /> <br /> Sze Pei’s presentation, Optimizing Void Performance of QFN Assembly, explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and the addition of a flux-coated solder preform.<br /> <br /> Sze Pei is responsible for ...
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present
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expert
Indium Corporation Technology Expert to Present at IMPACT Conference in Taiwan
2013-10-10 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/ning-cheng-lee/">Dr. Ning-Cheng Lee</a>, Vice President of Technology, will present at the <a href="http://www.impact.org.tw/2013/General/">International Microsystems Packaging Assembly and Circuits Technology conference</a> (IMPACT) on Thursday, October 24 in Taipei, Taiwan. <br /> <br /> Dr. Lee’s presentation, A Novel Epoxy Flux on Solder Paste for High-Reliability POP Assembly, ...
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present
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Indium Corporation Technology Expert to Present at IMPACT Conference in Taiwan
2013-10-09 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.<br /> <br /> Dr. Lee’s presentation, A Novel Epoxy Flux on Solder Paste for High-Reliability POP Assembly, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when ...
Tags: technology
present
corporation
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