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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/hongwen-zhang/">Dr. HongWen Zhang</a>, Research Metallurgist, will present at the <a href="http://www.binghamton.edu/ieec/symposium2013/symposium2013.html">2013 Electronics Packaging Symposium</a> October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach ...
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electronics
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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.<br /> <br ...
Tags: technology
present
electronics
corporation
Indium Corporation Technology Expert to Present at BTC Tech Symposium
2013-09-18 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/brook-sandy/">Brook Sandy-Smith</a>, Product Support Specialist – PCB Assembly Materials, will present at the <a href="http://www.solder.net/">Business Electronic Soldering Technologies</a> (BEST) 2013 Tech Symposium on Bottom Termination Components (BTC), September 25 in South Barrington, IL.<br /> <br /> Sandy-Smith’s presentation, Minimizing Voiding in BTC Assembly, reviews ...
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Indium Corporation Technology Expert to Present at BTC Tech Symposium
2013-09-18 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Brook Sandy-Smith, Product Support Specialist - PCB Assembly Materials, will present at the Business Electronic Soldering Technologies (BEST) 2013 Tech Symposium on Bottom Termination Components (BTC), September 25 in South Barrington, IL.<br /> <br /> Sandy-Smith’s presentation, Minimizing Voiding in BTC Assembly, reviews proven approaches to minimize BTC voiding, including solder paste optimization, process modifications, and the addition of engineered solder ...
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corporation
tech
Indium Corporation Technology Expert to Present at SMTA India
2013-09-11 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Liyakathali Koorithodi, Senior Technical Support Engineer, will present at the launch of a new SMTA chapter in Bangalore, India on September 25.<br /> <br /> Liyakathali’s presentation, Lead-Free Alternative Alloys, discusses the development of low cost alternatives to near-eutectic SAC alloys for Pb-free assembly. His presentation will compare alternative Pb-free alloys and explore whether existing processes need to be modified for alternative alloys.<br ...
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