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Tag: paste
Traceability/Verification Solution enhances solder paste printing.
2015-08-04 14:31:06| Industrial Newsroom - All News for Today
Powered by Speedline Open Apps Interface (OAI), MPM® PrinTrack™ provides accessible history details as to how each product was printed, when it was made, process parameters, and all pertinent information for tracking products or troubleshooting process. Web interface can be configured to produce traceability reports. While focused on printing process parameters, solder paste, and tooling, open architecture system can also integrate with other equipment and elements in manufacturing cycle.
Tags: solution
printing
paste
enhances
Indium Corporation Features Indium8.9HF Solder Paste at SMTAI
2015-08-03 12:31:15| Industrial Newsroom - All News for Today
Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill. Pb-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer...
Tags: features
corporation
paste
solder
Metallization Paste suits high temperature environments.
2015-05-04 14:31:05| Industrial Newsroom - All News for Today
Designed for mono- and multicrystalline silicon solar cells, SOL205B Back-Side Tabbing Paste optimizes Ag content and glass chemistry to provide consistent adhesion before and after high-temperature ageing. Product is typically dried in IR dryer with set point of 250–300°C in less than 20 seconds. With optimized busbar adhesion, paste contributes to module reliability.
Tags: high
temperature
environments
paste
Two-Part Epoxy Paste has ultra low thermal resistance.
2015-04-07 14:31:07| Industrial Newsroom - All News for Today
Master Bond EP48TC has thermal resistance of 5–7 x 10–6 K•m2/W, which enables thermal conductivity of 20–25 BTU•in/ft2•hr•°F. Applied in bond lines as thin as 10–15 microns, epoxy paste has tensile lap shear strength from 900–1,100 psi and bonds to metals, composites, glass, ceramic, and plastics. Working life for 100 gram batch at 75°F is 90–120 min. Curing at room temperature, it is serviceable over -100 to +300°F and available in ½ pint to 5 gallon containers.
Tags: low
ultra
resistance
thermal
Indium Corporation Releases BiAgX Solder Paste Technology as Drop-In Replacement for High-Pb Solders
2015-04-06 12:31:12| Industrial Newsroom - All News for Today
Environmental and legislative concerns are driving consumers away from products using solders that contain lead (Pb), including solders used in die-attach applications for analog semiconductor assembly. Indium Corporation's BiAgX solder paste technology is a high-melting, lead-free (Pb-free) solder paste technology...
Tags: technology
corporation
releases
replacement
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