Nordson DAGE, a division of Nordson Corporation, announced its most recent order from a major customer in the semiconductor industry for its XM8000 wafer X-ray metrology tool that will be used for the automatic measurement of wafer bumps and through silicon vias by using 2D and 3D x-ray inspection methods. David Bernard, Business Manager Automated X-ray Systems, commented, "The XM8000 represents an entirely new paradigm using Nordson DAGE's award winning X-ray technology in the heart of semiconductor manufacture, and that is why our system was selected for this project.