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DDR3 SDRAM Socket accepts 0.8 mm pitch, 96-pin BGA ICs.
2014-09-16 14:30:44| Industrial Newsroom - All News for Today
Able to socket 8 x 14 mm, 7.5 x 13 mm, 9 x 13 mm, and 9 x 16 mm ICs with BGA package on any PCB without any soldering, SG-BGA-6410 operates at bandwidths up to 8 GHz with less than 1dB insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Footprint adds 2.5 mm on each side, and construction includes shoulder screw and swivel lid. Latter incorporates quick insertion method to accelerate IC changeout. This story is related to the following:Printed Circuit Sockets | Ball Grid Array (BGA) Sockets
Tags: accepts
pitch
socket
ics
Emberlight smart socket lets you control any light bulb over WiFi
2014-07-23 03:33:18| Wireless - Topix.net
If you think it would be handy to control your home's lighting through your mobile device but you've still got a box full of ordinary light bulbs in the closet, emberlight bids itself as the solution: a smart socket that lets you control any light bulb with your smartphone.
Tags: over
control
light
smart
BGA Socket supports 1 mm pitch, 1924 pin BGA ICs.
2014-07-08 14:31:19| Industrial Newsroom - All News for Today
Accommodating 45 x 45 mm and 47.5 x 47.5 mm package sizes, Model SG-BGA-6409 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed with shoulder screw and swivel lid, socket is mounted on target PCB with no soldering. Device offers contact resistance of 20 mΩ per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C. This story is related to the following:Printed Circuit Sockets |
Tags: supports
pin
pitch
socket
Super Reeve Connector Socket
2014-07-03 14:00:00| Offshore Technology
Ropeblock
Boundary Scan Module facilitates DDR3-DIMM socket testing.
2014-07-01 14:31:10| Industrial Newsroom - All News for Today
Once plugged into test socket, CION Module SO-DIMM204-3/ECC allows structural test coverage of DDR3 memory interfaces. All signal pins, as well as almost all Ground-Pins, can be tested via Boundary Scan. Equipped with CION™ Boundary Scan ASIC, module can be connected to any Test Access Point (TAP) and lets user detect link failures. Tests take fractions of seconds, and even parallel testing of multiple memory interfaces is possible. This story is related to the following:Testing Instruments |
Tags: testing
module
scan
boundary
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