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Indium Corporation Product Specialist to Present at IMAPS Device Packaging
2014-03-06 05:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.<br /> <br /> Durham’s presentation, Solderability Challenges in Emerging BGA Packages, details the sequence of processes seen in typical BGA assembly and examines the effects of each set of prior processes on the solderability of the final pad.<br /> <br /> For more information ...
Tags: product
present
corporation
device
Indium Corporation's Ryan to Present at SMTA Intermountain Technical Meeting
2014-03-05 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Americas Sales Manager Pat Ryan will present at the SMTA Intermountain Chapter’s technical meeting on March 6 in Logan, Utah.<br /> <br /> Ryan’s presentation, What’s Trending in Our Assembly World, will give an update on non-wet opens, a review of new alloys and dopants, and electronics teardowns.<br /> <br /> For more information or to register for this event, visit the SMTA Intermountain Chapter’s webpage.<br /> <br /> Ryan is responsible ...
Tags: present
technical
meeting
ryan
Indium Corporation Features BiAgX(TM): New, High Temperature, Lead-Free Solder Paste ...
2014-03-04 05:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.<br /> <br /> BiAgX™ was created specifically for high-reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.<br /> <br /> BiAgX™ is excellent for small, low-voltage QFN ...This story is related to the following:Lead-Free Solder |
Tags: high
features
corporation
temperature
Oclaro to Demonstrate a 100G Coherent CFP2 Pluggable Module at OFC 2014; Leverages Indium ...
2014-03-03 06:00:00| Industrial Newsroom - All News for Today
New Coherent Pluggable Product Delivers Increased Density, Lower Power Consumption and Unrivalled Levels of Flexibility for 100G Metro and Long-Haul Networks<br /> <br /> SAN JOSE, Calif. — Oclaro, Inc. (NASDAQ: OCLR), a leading provider and innovator of optical communications solutions, today announced that it will be demonstrating a much-anticipated coherent CFP2 pluggable transceiver module at OFC 2014. Oclaro continues to focus on creating highly differentiated products based on its ...This story is related to the following:Transceivers
Tags: module
demonstrate
coherent
100g
Indium Corporation Technology Experts to Present at APEX
2014-02-27 06:00:00| Industrial Newsroom - All News for Today
Several Indium Corporation technology experts will present at IPC APEX March 25 – 27 in Las Vegas, Nevada.<br /> <br /> Dr. Ning-Cheng Lee, vice president of technology, will give two presentations. His first presentation, Low Cost High Reliability Assembly of POP with a Novel Epoxy Flux on Solder Paste, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when exposed to drop shock.<br /> <br ...
Tags: technology
present
corporation
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