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Indium Corporation Soldering Products Meet New IPC J-STD004B
2013-10-02 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk.<br /> <br /> Indium Corporation's full line of PCB assembly products were specifically designed to meet these new international standards, which help to improve both first pass yields and long-term reliability.<br /> <br /> Users' existing solder products may meet the existing J-STD-004, but could fail to ...This story is related to the following:Electronic Components and Devices Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category Sponsor AdSearch for suppliers of: Soldering Compounds | Soldering Flux | Flux Cored Wire | Printed Circuit Board (PCB) Handling Equipment |
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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/hongwen-zhang/">Dr. HongWen Zhang</a>, Research Metallurgist, will present at the <a href="http://www.binghamton.edu/ieec/symposium2013/symposium2013.html">2013 Electronics Packaging Symposium</a> October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach ...
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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.<br /> <br ...
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Indium Corporation's Tim Jensen to Give Tutorial at SMTAi
2013-09-26 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Tim Jensen, Product Manager - PCB Assembly Materials, will give a tutorial at SMTA International (SMTAi) on October 14, in Fort Worth, Texas.<br /> <br /> Jensen’s tutorial, Soldering Technology for SMT: Achieving High Yields and Reliability, discusses solder materials, components, and PCBs to help attendees understand the importance of each in attaining an electronics product that meets current and future legislative restrictions. Additionally, a detailed ...
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Indium Corporation's Technology Experts to Present at SMTAi 2013
2013-09-25 06:00:00| Industrial Newsroom - All News for Today
Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas.<br /> <br /> Dr. Ning-Cheng Lee, Vice President of Technology, will give three presentations.<br /> <br /> Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys explores replacing SAC solders with BiSnAg as a low-cost solution. The joint mechanical strength, drop test ...
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