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Indium Corporation Technology Expert to Present at ICEPT
2013-07-30 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/ning-cheng-lee/">Dr. Ning-Cheng Lee</a>, Vice President of Technology, will give two presentations and teach a professional development course at the <a href="http://www.icept.org/">International Conference on Electronic Packaging Technology</a> (ICEPT) August 11-14, in Dalian, China.<br /> <ul> <li> Low Cost High Reliability Assembly of Thermally Warped PoP with Novel Epoxy Flux on ...
Tags: technology
present
corporation
expert
Indium Corporation and Duksan Hi-Metal Form Strategic Alliance for SACM(TM) Solder Balls
2013-07-18 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for semiconductor packages. SACM™, a novel alloy composition developed by Indium Corporation, provides the foremost reliability performance in terms of both drop-shock and thermal cycling. Solder joint architectures that utilize both SACM™ solder paste and SACM™ solder balls realize the maximum ...
Tags: form
corporation
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alliance
Indium Corporation Technology Expert to Present at SMTA Ohio Valley
2013-07-02 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/mario-scalzo/">Mario Scalzo</a>, Senior Technical Support Engineer, will present at the <a href="http://www.smta.org/">Surface Mount Technology Association</a>’s Ohio Valley Expo and Tech Forum, July 11 in Independence, Ohio.<br /> <br /> Scalzo’s presentation, Effects of Thermal Pad Patterning on QFN Voiding, discusses the major challenge of eliminating voids underneath low ...
Tags: technology
present
corporation
expert
Indium Corporation Technology Expert to Present at SMTA Ohio Valley
2013-07-02 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Mario Scalzo, Senior Technical Support Engineer, will present at the Surface Mount Technology Association’s Ohio Valley Expo and Tech Forum, July 11 in Independence, Ohio.<br /> <br /> Scalzo’s presentation, Effects of Thermal Pad Patterning on QFN Voiding, discusses the major challenge of eliminating voids underneath low standoff components. This presentation explores what causes voiding and presents results to help optimize thermal performance and ...
Tags: technology
present
corporation
expert
Indium Corporation Technology Expert to Deliver Webtorial on Top Pb-free PCB Assembly Defects
2013-06-04 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/tim-jensen/">Tim Jensen</a>, Product Manager – PCB Assembly Materials, will present a two-part webtorial, titled Top Pb-Free PCB Assembly Defects: Cause and Cure, as part of a webtorial series sponsored by the <a href="http://www.smta.org/">SMTA</a>. The webtorials are scheduled from 1-2:30 p.m. EDT on June 11 and 25.<br /> <br /> This two-part webtorial will discuss the top PCB ...
Tags: top
technology
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