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OneWeb Mechanical Engineer, Structural Analysis Spacecraft Components mf

2016-03-21 18:09:02| Space-careers.com Jobs RSS

Airbus Defence and Space is a division of Airbus Group formed by combining the business activities of Cassidian, Astrium and Airbus Military. The new division is Europes number one defence and space enterprise, the second largest space business worldwide and among the top ten global defence enterprises. It employs some 40,000 employees generating revenues of approximately 14 billion per year. A vacancy for a Mechanical Engineer, Structural Analysis Spacecraft Components mf has arisen within Airbus Defence Space in Toulouse. The OneWeb project aims to provide permanent and affordable web connectivity throughout the world. Airbus Defence Space was selected by OneWeb as a partner for developing and producing a new generation of 900 satellites, leading to a revolutionary change in our Space industry and creating the first mass production of satellites in history. Within the French subsidiary of the Airbus OneWeb Satellites Joint Venture, your main tasks and responsibilities will include Working closely with structural engineers and designers, including developing design guidelines, performing drawing reviewsiterations, supporting failure investigations, and mentoring Developing structural guidelines such as margin definitions, design loads, allowances material properties Modelling generation and maintenance iterating quickly during design phases Performing static analysis stress margins for spacecraft, modules, and component hardware Performing dynamic analysis acoustic, vibration, launch vehicle coupled loads coordination Ensuring test support materialcoupon, modal, static load, vibration, acoustic. This role will involve some travel for business 20 of the time, worldwide and as such you must be able to travel accordingly. We are looking for candidates with the following skills and experience Educated to degree level or equivalent, 7 years of experience analysing spacecraft mechanical systems with considerations for manufacturing, assembly, integration, and testing, Experience with finite element software prepost processors and solvers, such as NASTRAN, ANSYS, Abaqus, FEMAP, Matlab knowledge would be a plus, Ideally, handson experience developing satellite hardware or prototypes in a multidisciplinary team environment Interpersonal skills to drive projects within an international environment, Excellent communication and coordination skills, Proactive and independent approach, ability to make decisions, Negotiation level of English French would be a plus. Please apply online for this vacancy with your CV attached in English. Airbus Group is committed to achieving workforce diversity and creating an inclusive working environment. We welcome all applications irrespective of social and cultural background, age, gender, disability, sexual orientation or religious belief. Airbus Group Recruitment Centre To apply click here

Tags: analysis components mechanical structural

 

Sand Traxx Imprint Sandals Feature Water Jet Cut Rubber Components

2016-03-21 11:31:09| Industrial Newsroom - All News for Today

Flip Flops Let Wearers Leave Changeable Message in the Sand  ST. MICHAEL, Minn.  Waterjet systems manufacturer Jet Edge, Inc. is helping Minnesota inventor Jeffrey Wagener make his mark in the world and on a beach near you with his Sand Traxx changeable imprint sandals, which feature waterjet cut rubber...

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Wet Electrolytic Tantalum Capacitors employ high CV components.

2016-03-18 13:31:06| Industrial Newsroom - All News for Today

Supplied in hermetically sealed welded tantalum can and header assembly, shock- and vibration-resistant TWA-Y Series include 470 µF/100 V and 1,000 µF/75 V components. These products, designed for continuous operation at 200°C (with applicable derating), provide endurance ratings up to 2,000 hr and exhibit stable electrical parameters from -55 to +200°C. Cathode system enables high-CV performance in standard DSCC case sizes from T1–T4.

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Samsung Introduces Full Line-Up Of LED Components Based On Chip-Scale Packaging Technology

2016-03-18 07:20:20| surfacefinishing News Articles

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, recently introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages

Tags: full based technology led

 

Vishay Intertechnology to Exhibit Industry-Leading MOSFETs, ICs, Passive Components, Diodes, and Optoelectronics at APEC 2016

2016-03-16 11:31:10| Industrial Newsroom - All News for Today

MALVERN, Pa. Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the Applied Power Electronics Conference and Exposition (APEC) 2016, taking place March 20-24 in Long Beach, California. In booth 2017, the company will be highlighting its latest industry-leading power MOSFET, IC...

Tags: components exhibit passive ics

 

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