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Blending And Drying High Density Powders

2014-10-09 13:56:43| chemicalonline Downloads

For years, the challenge of blending extremely dense slurries, then drying the batch to powder form, has been a job for the traditional vacuum dryer with a rotating vessel.

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Microsemi Expands Customer Application Design Opportunities By Introducing SmartFusion2 Advanced Development Kit With Largest Density 150K LE Device

2014-09-30 13:13:07| wirelessdesignonline News Articles

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company's new largest density, lowest power SmartFusion®2 150K LE System-on-Chip (SoC) FPGA Advanced Development Kit.

Tags: advanced design development customer

 
 

Sheet Molding Compounds feature ultra-low density.

2014-09-15 14:32:31| Industrial Newsroom - All News for Today

Featuring nominal density of 1.2 sp.gr, Mirilite™ SMC demonstrates automotive Class A surface performance and can achieve ALSA rating of 57–63. Product is suited for exterior applications in automobiles and heavy trucks, including hoods, door panels, and trunk deck lids. Econolite™ SMC, offering nominal density of 1.18 sp.gr, is suitable for reinforcement structures and other components that do not require high-appearance painted surface finish, but which benefit from weight reduction. This story is related to the following:Sheet Molding Compounds (SMC)

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Siemon responds to global data center demand with V800 high density cabinet system

2014-09-11 19:00:00| Siemon Press Release Feed

Siemon has announced the launch of its V800 cabinet system, designed to provide a robust, high performance enclosure that is cost-effective for both high density data center environments as well as floor distributors...

Tags: high system data center

 

DrMOS Power Stages deliver high current, efficiency, density.

2014-09-11 14:30:49| Industrial Newsroom - All News for Today

Supplied in low-profile, 5 x 5 mm, 31-pin, thermally enhanced PowerPAK® MLP, SiC620 VRPower® integrated power stages combine high- and low-side TrenchFET® Gen IV n-channel MOSFETs, MOSFET driver IC, and bootstrap Schottky diode. Devices are fully compliant with DrMOS 4.0 specification and deliver currents in excess of 60 A per phase and up to 95% peak efficiency. With minimized package parasitics, devices enable switching frequencies to 1.5 MHz.<br /> This story is related to the following:Integrated Circuits (IC)

Tags: high current power deliver

 

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