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Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
2014-07-08 14:31:19| Industrial Newsroom - All News for Today
GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. This story is related to the following:Materials and Material ProcessingSearch for suppliers of: Bonding Machinery
Tags: platform
fusion
promotes
bonding
Grounding and Bonding Part 1 of 2
2014-06-16 22:41:18| Electrical Construction & Maintenance
By Mike Holt, NEC Consultant Among the revisions to Art. 250, the 2014 NEC made some important wording changes that clear up confusion. read more
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part
bonding
grounding
Kingyoup Unveils High Throughput Semiconductor Wafer Bonding & Debonding Tool at ECTC ...
2014-06-13 06:00:00| Industrial Newsroom - All News for Today
NEW TAIPEI CITY – KingyoupOptronics Co., Ltd. ("Kingyoup") during the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased their temporary bonding and debonding equipment developed in collaboration with IBM (NYSE:IBM). This equipment is specially designed to meet the microelectronics miniaturization needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D Integrated Circuits, 2.5D Packaging ...This story is related to the following:Wafer Processing Systems |
Tags: high
tool
amp
semiconductor
Equipotential Bonding Requirements for Pools
2014-06-04 14:58:00| Electrical Construction & Maintenance
By Mike Holt, NEC Consultant The installation requirements for permanently installed pools are outlined in Part II of Article 680 in the 2011 NEC. read more
Tags: requirements
pools
bonding
Research and Markets: Permanent Wafer Bonding for Semiconductor:...
2014-05-26 21:38:52| Semiconductors - Topix.net
The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group , SUSS MicroTec, and TEL .
Tags: research
permanent
markets
semiconductor
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