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Electron Beam Metallization System suits 100 and 150 mm wafers.

2014-06-11 14:30:48| Industrial Newsroom - All News for Today

Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping capacity of 39,000 L/sec, UEFC-4900 can process up to 25 150 mm wafers/batch. This story is related to the following:Machinery and Machining Tools Sponsored by: AMT (IMTS) - Category Sponsor April2014Wafer Processing Systems | Electron Beam (EB) Machinery | Electron Beam Physical Vapor Deposition (EBPVD) Coating Equipment |

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