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Tag: thermal
New Catalogue for Compact Thermal Imaging Cameras
2015-12-03 11:31:09| Industrial Newsroom - All News for Today
The new catalogue for "compact thermal imaging cameras" is now available and includes all current thermoIMAGER TIM models. The range has even increased with many new products. The new catalogue based on the theme of "compact thermal imaging cameras" is now available online and as printed matter. Detailed...
Tags: cameras
compact
catalogue
thermal
Structure and Thermal Engineer mf
2015-12-02 20:04:58| Space-careers.com Jobs RSS
LuxSpace Srl LU, a subsidiary of OHB DE, is offering Micro Satellites, TTC subsystems, system consultancy, engineering and integration and application services as well as related RD to national and international customers. LuxSpace is recruiting an experienced structure and thermal engineer 5 years of relevant experience required for immediate employment. Job Profile An experienced structure and thermal engineer is required to complement the mechanics team at LuxSpace. Heshe reports directly to the Head of mechanics and propulsion. Required Skills and Tasks to be performed Structural analysis analytical and FEA Thermal analysis analytical and FEA Mechanical design Knowledge in spacecraft propulsion andor design for manufacturing are considered an asset Candidate Profile and Qualities University degree MasterDiplomaPhD or equivalent in a relevant field Experience in structure and thermal engineering 5y, gained in a professional position, preferably in the Aerospace industry with focus on micro satellites Proficient in mastering relevant CADFEA tools e.g. SolidWorks, Hyperworks, ESATAN Handson experience Ability to work and interface with multinational team Selfmotivated taking responsibility and being proactive Willingness to travel Languages Good English language skills spoken and written, German andor French knowledge will be considered an asset Driving license desirable class B EU citizenship or valid Luxembourg work permit mandatory for nationals from nonEUcountries or countries treated as such. NonEU citizens without valid Luxembourg work permit cannot be taken into consideration. Information on legal restrictions and requirements www.guichet.lu Start Date Immediate By arrangement Contract Type Permanent employment contract, fulltime Application Candidates are welcome to apply in English language by submitting a personal cover letter and CV Europass format preferred. Applications should be solely sent by email documents to be combined in 1 single attachment, PDF format, 5 MB max.. Please forward your applicationCV, including salary requirements gross per year, in English to recruitmentluxspace.lu .
Tags: structure
engineer
thermal
mf
Lyophilization - Thermal Characterization as Part of an Empirical Process for Developing Optimized Formulations and Lyo Cycles
2015-11-25 14:11:24| drugdiscoveryonline Home Page
Date: Wednesday, January 13, 2016 Time:1pm - 2:30pm EST US Duration: 90 Minutes - Online Price: $299 - Includes Bonus Handouts!
Tags: part
process
developing
thermal
Gap Filler exhibits low thermal resistance.
2015-11-24 14:31:06| Industrial Newsroom - All News for Today
Available in sheets from 0.3–3.0 mm thick, Sarcon® GR80A can be die-cut to fit almost any application shape. Silicone-based material completely fills air gaps between uneven components, board protrusions, and recessed areas while exhibiting very low pressure. When placed between heat source such as semiconductor and nearby heat sink, thermal interface material provides thermal conductivity of 13.0 W/m°K per ASTM D5470 and thermal resistance as low as 0.50°C cm²/W.
Tags: low
resistance
gap
exhibits
Thermal Analysis Devices deliver long-term stability, durability.
2015-11-20 14:31:05| Industrial Newsroom - All News for Today
With FlexCal® technology that automatically applies calibration parameters to match heating rate, method gas, and crucible type, bottom-bonded surface stabilized DSC sensors offer indium height to width ratio of 19.5 mW/°C and >155 mW/°C when applying data optimization. DSC 3+ is operated by 14.0 STARe Thermal Analysis software with single frequency modulated temperature technique and optional TOPEM® multi-frequency modulated technique. TGA/DSC 3+ has XP micro- and XPU ultra-microbalances.
Tags: analysis
devices
deliver
stability
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