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BioPlastics Improves Customer Response with ZW3D CAD/CAM
2014-08-05 06:00:00| Industrial Newsroom - All News for Today
Guangzhou, China — ZW3D, one of the world's leading suppliers of advanced CAD/CAM solutions for the manufacturing industry, today announced it has been chosen by BioPlastics, the leading manufacturer of coated webbing products, for efficient mold design, helping them respond to customers faster than ever with saved costs.<br /> <br /> BioPlastics is a leading global manufacturer of coated webbing and assemblies, with products widely applied in markets like equine, medical, sporting ...This story is related to the following:ServicesSearch for suppliers of: CAD/CAM Software |
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response
improves
customer response
New catalyst improves conversion of CO2 to syngas
2014-07-30 19:30:56| Green Car Congress
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conversion
catalyst
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Silicone-Based Material improves semiconductor performance.
2014-07-30 14:32:03| Industrial Newsroom - All News for Today
Available as 1.0 mm thick sheet, Sarcon® XR-Pe delivers thermal conductivity of 11 W/m°K with thermal resistance as low as .06°C in.²/W. Silicone-based material conforms to most CPU and semiconductor shapes with minimal compression force requirement, and soft-touch characteristic is maintained for applications that require material compression from 30%–90%. Supporting use from -40 to +150°C, material helps improve semiconductor performance by transferring unwanted heat to nearby heat sink. This story is related to the following:Thermal Management Materials |
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performance
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semiconductor
Damage Prediction Model Improves Storm Response
2014-07-28 20:48:00| Transmission & Distribution World
Dean C. Desautels, Connecticut Light and Power After the storms of 2011, CL&P developed a method of linking pre-storm weather forecasts to operational preparedness. read more
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response
damage
storm
On-Chip Network improves memory subsystem support and QoS.
2014-07-28 14:31:13| Industrial Newsroom - All News for Today
SonicsGN™ v2.2 on-chip network IP improves support for memory subsystems and promotes performance with bandwidth allocation across multiple SoC flows. Incorporated memory subsystem and non-blocking concurrency technologies enable support for DDR4 and LPDDR4 memories for both compute and communication traffic on multi-core SoCs. Features fully support multi-threading capabilities of OCP interface, while scalable model ensures QoS allocates resource bandwidth and minimizes latencies. This story is related to the following:Electronic Components and DevicesSearch for suppliers of: Chip Networks
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network
memory
improves
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