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Tag: plasma
Customers Embrace Cascading Arc Technology Using Oerlikon Metco's SinplexPro Plasma Spray Gun
2015-08-27 12:31:11| Industrial Newsroom - All News for Today
Winterthur, Switzerland New SinplexPro spray gun appeals to a large customer base because it allows applicators to standardize coating parameters across multiple spray systems. Oerlikon Metco today reported brisk sales of its SinplexPro plasma spray gun and that the rate of adoption is increasing steadily. The...
Tags: technology
customers
gun
plasma
Plasma Treatment Systems expand up to 6 chambers.
2015-08-25 14:31:06| Industrial Newsroom - All News for Today
Configurable with 2, 4, or 6 chambers, StratoSPHERE™ Series is intended for wafer-level packaging and 3D packaging applications. Systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations. Designed to handle semiconductor wafers up to 12 in. in diameter, systems can process thin wafers with or without carrier, depending upon wafer thickness.
Tags: systems
treatment
expand
plasma
Plasma Etch, Inc. Releases New Technical Details About the World's First Plasma Etching System Requiring No CF4 Gas
2015-08-07 12:31:18| Industrial Newsroom - All News for Today
Carson City, NV Plasma Etch Inc, a leader in plasma innovation, has release new details about the workings of the Magna plasma etching system. The Magna series utilizes the newest technologies available, eliminating the need for CF4 gas, a harmful contributor to ozone layer depletion. CF4 gas is presently used by...
Tags: no
system
details
technical
Plasma Treatment Systems serve semiconductor applications.
2015-07-07 14:31:06| Industrial Newsroom - All News for Today
Targeting wafer-level and 3D packaging applications, TrophoSPHERE™ and StratoSPHERE™ support automated handling and processing of round or square wafers and perform descum, ashing, dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Troposphere is designed for high-throughput processing of semiconductor wafers and other flat substrates in sizes from 3–8 in. dia for wafers held in open cassettes, while StratoSPHERE handles semiconductor wafers up to 12 in. dia.
Tags: systems
applications
treatment
serve
Architect on the PPS projet Plasma Propulsion Subsystem mf
2015-07-02 02:05:00| Space-careers.com Jobs RSS
Airbus Defence and Space is a division of Airbus Group formed by combining the business activities of Cassidian, Astrium and Airbus Military. The new division is Europes number one defence and space enterprise, the second largest space business worldwide and among the top ten global defence enterprises. It employs some 40,000 employees generating revenues of approximately 14 billion per year.A vacancy for an Architect on the PPS project Plasma Propulsion Subsystem mf has arisen within the Airbus Defence and Space in Toulouse. You will join the Electrical Propulsion MSC department.You will lead engineering activities related to the electric propulsion functional chain for a Telecom satellite project new development, and you will report to the head of the Electric Propulsion department in the Telecom Satellites Business Unit in Toulouse.Your main responsibilities will be Being the architect for the chain and coordinating associated activities with the support of the equipment manager Summarising electric propulsion chain definition and validation for the satellite project Defining electric propulsion chain architecture and technical characteristics, taking into account the implementation of new equipment on Eurostar3000 satellites e.g. new thruster module and new power processing unit Analysing propulsion chain design and qualification status versus the satellite Customer requirements Defining specific propulsion performance, budget and interaction analysis with regard to the spacecraft, if any Defining, preparing and following up on the validation and testing activities, potentially for equipment and on the SC bench ATB, then directly on the satellite supporting AIT activities, assessing the tests and analysingprocessing raised anomalies Assessing equipment configuration status and performances, performing impact analysis on equipment deviationswaivers Participating on different satellite project reviews Preliminary Design Review, Critical Design Review, Test Readiness Review and Test Review Board Interfacing with the project team and technical manager on various subjects mechanical, thermal, electrical, functional and modelling, for the procurement, AIT and operations departments.We are looking for candidates with the following skills and experienceEducated to a Masters degree level in mechanics and fluidics or in electronics,At least 5 years of experience in subsystem engineering and propulsion design for space projects or satellite projects,Capability to interface with different technical areas e.g. mechanical, thermal, electrical and functional,Meticulous, good communication and summary skills,Ability to work within a team environment,Negotiation level in English and intermediate level in French. Please apply online. Airbus Group is committed to achieving workforce diversity and creating an inclusive working environment. We welcome all applications irrespective of social and cultural background, age, gender, disability, sexual orientation or religious belief.Airbus Group Recruitment CentreTo apply click here
Tags: projet
plasma
architect
pps
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